Technical Data Base: Epoxy resin unfilled Texture: Viscous Colour: Transparent Mixing Ratio by Weight (Resin / Hardener): 1:1 Density of the Mixture: 1,15 g/cm³ Viscosity of the Mixture at 20°C (+68°F): 8.500 mPa·s Adhesive Gap Bridging up to Max.: 2 mm.

Processing Temperature: +10 to +30 °C Curing Temperature: +6 to +40 °C Pot life at 20°C (+68°F) for 10ml material: 3-4 min.

Handling Strength (35% strength) after: 30 min. Capable of Bearing Mechanical Loads (50% strength) After: 1 hour Final Strength (100%) After: 24 hour Medium strength of the pure epoxy resin according to DIN EN 146 Pressure: 9 Mpa Pull: 40 Mpa Bending: 58 Mpa E-Modul: 2.000 - 2.500 Mpa Shore Hardness D: 65 Medium shear strength according to DIN EN 1465 at Steel Sand Blasted: 20 N/mm² Alu Sandblasted: 19 N/mm² PVC Hard-roughened: 13 N/mm² Linear Shrinkage: 2,0 % Temperature Resistance: -50 to +80 °C Accessory: Mixing Nozzles Easy-Mix Surface Pre-Treatment To ensure a perfect bond, the surfaces to be joined must be clean and dry (e.g., clean and degrease using WEICON Surface Cleaner).

Processing Epoxy Minute Adhesive can be processed directly from the double cartridge.

Reject the first centimetre of the dosed bead. Mix the product thoroughly.

Apply adhesive mixture quickly to only one of the surfaces to be bonded.

Join both surfaces immediately afterwards.